A172

Description:

A172 is a low profile, rugged high performance embedded computer (HPEC) that provides exceptional design flexibility in a low power, high performance computing system. Based on a standard Type 6 Com Express module, the A172 features the ability to support multiple processor options for easy system integration as well as cost-effective technology upgrades.

With a weight under 2.25 kg with dimensions of only 260 x 180 x 46 mm, the A172 maximizes SWaP-C for applications with limited space requirements.

Besides a flexible architecture for upgrading the CPU to the next generation it also features expansion options such as mini-PCIe cards and up to 1 TB of removable storage. The A172 includes multiple I/O interfaces that make the rugged unit ideal for high impact, high performance defense applications. These include manned and unmanned fixed- and rotary-wing airborne (UAV) platforms.

Features:

• Rugged Reduced SWaP-C PC
• Intel® Xeon E3, Core i7 or Core i3 CPU
• Up to 32 GB DDR3L SDRAM
• 128 or 512 GB Mini SATA SSD
• Removable 1 TB Mass Storage SATA SSD option
• Gigabit Ethernet, Discrete I/O, Serial Ports, DVI Outputs, USB 2.0, CANbus, Stereo Audio, Line IN + Line OUT, Composite Video Inputs
• D38999 I/O and Power Connectors
• Compact and Lightweight
• Wide Input Voltage Range
• MIL-STD-704 and MIL-STD-1275 Compliant
• Modular Design, Custom Configurations Available
• Operating System Support Windows® and Linux®
• Environmentally Sealed (IP65)
• Natural Convection Cooled
• No Electrolytic Capacitors

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